Product Description

❄️ Core Specs & Cooling Power

• 25 W cooling capacity, built around a semiconductor (TEC) chip, offering effective heat dissipation for smartphones—and even tablets, though it’s best suited for phones

• Semiconductor area: ~1,600 mm²; cooling plate area: ~3,631 mm²

📏 Design & Build

• Compact dimensions: approx. 74 × 29 mm—easy to clip on the back of a phone

• Weight: Around 120 g—not featherlight, but still portable

• Materials: Durable ABS housing with magnetic mounting and a ring-grip/clip mechanism

• Visual flair: Built‑in ring-light (likely RGB)—adds gaming aesthetic and ambient lighting

🧲 Mounting & Compatibility

• Magnetic attachment, making installation quick and seamless

• Also doubles as a clip or ring grip, providing a portable stand option for horizontal viewing

🔌 Power & Operation

• Likely powered via USB‑C under QC 3.0 (quick charge) standards for optimal energy delivery to the TEC system

• No explicit power source specs, but expect ≥5 V/3 A for full cooling performance.