Product Description

🧊 Cooling Performance & Technology

• Semiconductor (TEC) cooling chip: Rapidly reduces phone surface temperature by approximately 10–20 °C

• Cooler power not explicitly specified for BR7, but its sibling BL7 model supports up to 15 W–20 W thermal output . Expect similar capacity for BR7.

🧲 Magnetic Design & Compatibility

• Strong magnetic suction, allowing quick attachment/removal on phone back

• Includes a ring-grip style mount—doubles as a phone grip/stand

⚙️ Form Factor & Build

• Likely lightweight and slim; one listing mentions as little as 20 g although context unclear

• Built with foldable clamp or ring-style interface, designed for modern 69–92 mm phone widths

• Possible inclusion of RGB lighting—suggested from packaging photos

🔌 Power & Connectivity

• Powered via USB-C or Type-C cable (standard for gaming accessories).

• Requires a sufficiently strong power source (likely 5 V, ≥3 A) to activate the semiconductor cooler—underpowered sources may cause performance issues